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集成电路.脉冲抗干扰度测量.第3部分:非同步瞬时注射法
Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method
参考页数：66P;A4
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分立半导体器件及集成电路.第5-2部分:光电元件.基本额定值及特性
Discrete semiconductor devices and integrated circuits - Part 5-2: Optoelectronic devices - Essential ratings and characteristics
参考页数：66P.;A4
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分立半导体器件及集成电路.第5-3部分:光电元件.测量方法
Discrete semiconductor devices and integrated circuits - Part 5-3: Optoelectronic devices - Measuring methods
参考页数：90P.;A4
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集成电路 生产线批准应用指南
Integrated circuits - Manufacturing line approval application guideline
参考页数：47P.;A4
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半导体器件.集成电路.第23-2部分:混合集成电路和薄膜结构.生产线认证.内部审查和特殊试验
Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures; Manufacturing line certification; Internal visual inspection and special tests
参考页数：97P.;A4
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半导体器件 集成电路 第3部分:模拟集成电路 修改2
Semiconductor devices; integrated circuits; part 3: analogue integrated circuits; amendment 2
参考页数：13P.;A4
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半导体器件 集成电路 第11部分:半导体集成电路(不包括混合电路)分规范 修改1
Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits; Amendment 1
参考页数：6P.;A4
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半导体器件 集成电路 第2部分:数字集成电路 第9节:MOS紫外线擦除可编程只读存储器空白详细规范
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits; section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories
参考页数：16P.;A4
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半导体器件 集成电路 第2-11部分:数字集成电路 单电集成电路可擦、可编程、只读存储器集成电路空白详细规范
Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory
参考页数：15P.;A4
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半导体器件 集成电路 第2部分:数字集成电路 第2节:HCMOS数字集成电路(54/74HC、54/74HCT、54/74HCU系列)族规范 修改1
Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 2: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU; Amendment 1
参考页数：3P.;A4
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