|
半导体器件的机械标准化.第6部分:平面式安装半导体器件外壳外形图绘制的一般规则(IEC 60191-6-2009).德文版本EN 60191-6-2009
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009
参考页数：40P;A4
|
|
|
|
|
|
半导体器件的机械标准化.第6-20部分:表面安装半导体器件封装外形图绘制的一般规则.小外形J-引线封装(SOJ)的封装尺寸规格测量方法(IEC
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
参考页数：14P.;A4
|
|
|
|
|
|
半导体器件的机械标准化.第6-18部分:表面安装半导体器件封装外形图绘制的一般规则.球状栅极阵列封装体(BGA)的设计指南(IEC 60191-6-18-2010 + Cor.-2010).德文版本EN 60191-6-18-2010
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010
参考页数：22P;A4
|
|
|
|
|
|
半导体器件的机械标准化.第6-6部分:平面安装的半导体器件外壳草图制备的一般规则.小螺距刃片栅格排列的设计指南(FLGA) (IEC 60191-6-6:2001);德文版本 EN 60191-6-6:2001
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001
参考页数：13P.;A4
|
|
|
|
|
|
关于CAx系统中电机和电器之间协同工作能力的要求.德文版本IEC/PAS 62515-2007
Requirements concerning the interoperability between electromechanical and electrical applications in CAx-systems; German version IEC/PAS 62515:2007
参考页数：32P.;A4
|
|
|
|
|
|
半导体器件的机械标准化.第6-4部分:表面安装半导体器件封装外形图绘制的一般规则.焊球网格阵列(BGA)封装尺寸的测量方法
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003
参考页数：20P.;A4
|
|
|
|
|
|
半导体器件的机械标准化.第6-2部分:表面安装半导体器件封装外形图纸制备的一般规则.1.5mm、1.27mm和1.00mm 节球和柱式终端封装的设计指南 (IEC 60191-6-2:2001); 德文版本 EN 60191-6-2:2002
Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002
参考页数：14P.;A4
|
|
|
|
|
|
电工技术用文件的编制.第1部分:规则
Preparation of documents used in electrotechnology - Part 1 : rules
参考页数：134P.;A4
|
|
|
|
|
|
图形符号对象的状态表示
Representation of states of objects by graphic symbols
参考页数：38P.;A4
|
|
|
|
|
|
半导体器件的机械标准化 - 第6-17部分: 表面安装的半导体器件封装外形图绘制的一般规则 - 层叠封装的设计指南 - 细间距球栅阵列和细间距基板栅格阵列 (P-PFBGA和P-PFLGA)
Mechanical standardization of semiconductor devices - Part 6-17 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
参考页数：31P;A4
|
|
|
|
|
