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无金属化孔单双面碳膜印制板规范
Specification for single and double sided carbon-coated printed boards without interlayer connection
价格:¥0.00
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印制底板组装件通用规范
Assemblies,electrical backplane,printed-wiring,general specification for
价格:¥0.00
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印制电路板组件装焊后的洁净度检测及分级
Purity examination and discrimination of the welded PCA assembles
价格:¥0.00
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覆铜箔聚苯醚玻纤布层压板.详细规范
Detail Specification for Polyphenylene Oxide Woven Glass fibre Copper Clad Laminate
价格:¥0.00
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印制板组装件总规范
Printed board assemblies
价格:¥0.00
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印制板组装件抗振动冲击技术要求和测试方法
Technical specifications,vibration shock test methods for printed board assembly
价格:¥0.00
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印制线路板用阻燃型覆铜箔环氧玻璃布层压板详细规范
Detail specification for epoxide woven glass fabric copper-clad laminated sheets of flammability resistance for printed wiring boards
价格:¥0.00
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热固性绝缘塑料层压管.棒总规范
Insulation,plastics,tubes,rods,laminated thermosetting,general specification for
价格:¥0.00
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热固性绝缘塑料层压板试验方法
Test methods for insulation plastics sheet laminated thermosetting
价格:¥0.00
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印制底板组装件设计要求
Design requirement for printed-wiring electrical backplane assemblies
价格:¥0.00
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