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半导体器件的机械标准化 第1部分：半导体器件图形绘制
Mechanical standardization of semiconductor components Part 1 Preparation of drawings of semiconductor components
参考页数：
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半导体光电模块GH83型光耦合器详细规范
Semiconductor opto-electronic module Detail specification for type GH83 opto-couplers
参考页数：10P.;A4
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半导体光电模块GD83型PIN-FET光接收模块详细规范
Semiconductor opto-electronic module Detail specification for type GD83 PIN-FET opto-receiver module
参考页数：15P.;A4
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半导体光电模块GD82型PIN-FET光接收模块详细规范
Semiconductor opto-electronic module Detail specification for type GD82 PIN-FET opto-receiver module
参考页数：15P.;A4
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微波组件.WFH362型双平衡混频器详细规范
Microwave assembly.Detail specification for model WFH362 double balanced mixer
参考页数：9P.;A4
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半导体器件10keV低能X射线总剂量辐射试验方法
10keV X-ray total dose radiation testing method of semiconductor devices
参考页数：13P.;A4
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电子元器件详细规范.3DA98型NPN硅高频大功率晶体管
Detail specification for electronic components.Type 3DA98 NPN silicon high-frequency power transistor
参考页数：13P.;A4
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电子元器件详细规范.3DA505型L波段硅脉冲功率晶体管
Detail specification for electronic components.Type 3DA505 L band silicon pulse power transistor
参考页数：11P.;A4
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电子元器件详细规范.3DA504型S波段硅脉冲功率晶体管
Detail specification for electronic components.Type 3DA504 S band silicon pulse power transistor
参考页数：11P.;A4
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半导体电阻应变计空白详细规范评定水平E(可供认证用)
Blank detail Specification for the semiconductor resistance strain gage Assessment level E
参考页数：9P.;A4
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