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印制电路用镀铜热固层压板的标准规格
Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
参考页数:5P.;A4
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测定印刷导电材料的电阻率的试验方法
Test Method for Determining the Electrical Resistivity of a Printed Conductive Material
参考页数:3P.;A4
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印刷线路板触点上存在杂质的标准试验方法
Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
参考页数:3P.;A4
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高分子基微波电路基材的相对介电率 (介电常数) 和电损耗因数的标准试验方法
Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates
参考页数:13P.;A4
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印制电路用镀铜热固层压板的标准规格
Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring
参考页数:5P.;A4
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薄膜开关或印刷电子设备对最终支撑结构的处理和应用的标准指南
Standard Guide for Handling and Application of a Membrane Switch or Printed Electronic Device to its Final Support Structure
参考页数:3P.;A4
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薄膜开关或印刷电子设备对最终支撑结构的处理和应用的标准指南
Standard Guide for Handling and Application of a Membrane Switch or Printed Electronic Device to its Final Support Structure
参考页数:3P.;A4
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测定印刷导电材料的电阻率的试验方法
Test Method for Determining the Electrical Resistivity of a Printed Conductive Material
参考页数:3P.;A4
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印刷线路板触点上存在杂质的标准试验方法
Standard Test Method for Presence of Foreign Matter on Printed Wiring Board Contacts
参考页数:3P.;A4
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高分子基微波电路基材的相对介电率 (介电常数) 和电损耗因数的标准试验方法
Standard Test Method for Relative Permittivity (Dielectric Constant) and Dissipation Factor of Polymer-Based Microwave Circuit Substrates
参考页数:13P.;A4
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