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钎焊电子组件的工艺要求.通孔安装组件
Workmanship requirements for soldered electronic assemblies - Through-hole mount assemblies
参考页数：50P.;A4
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抑制无线电干扰用整套滤波装置.空白详细规范.抑制电磁干扰用无源过滤装置.要求安全试验的过滤器(评定等级D/DZ)
Complete filter units for radio interference suppression-Part 2-1:Blank detail specification-Passive filter units for electromagnetic interference suppression-Filters for which safety tests are required (assessment level D/DZ)
参考页数：19P.;A4
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钎焊电子组件的工艺要求.表面安装组件
Workmanship requirements for soldered electronic assemblies - Surface-mount assemblies
参考页数：68P;A4
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电气材料, 印刷电路板和其它互联结构和组件的试验方法. 第2-721部分: 互连结构材料试验方法. 使用分离介质柱谐振腔法测定微波频率下覆铜板相对介电常数和介质损耗角正切值 (IEC 61189-2-721-2015); 德文版本EN 61189-2-721-2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad lamin
参考页数：25P.;A4
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电子组装技术. 第4部分: 区域阵列类型包装表面安装设备的焊接接缝的耐久性试验方法 (IEC 62137-4-2014); 德文版本EN 62137-4-2014 + AC-2015
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015
参考页数：44P.;A4
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电子组件用连接材料.第1-2部分:电子组件高质量互连用焊剂的要求(IEC 61190-1-2-2014);德文版本EN 61190-1-2-2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014
参考页数：24P.;A4
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印刷版和印刷版总成.设计和使用.第7部分:CAD图书馆结构的电子元器件零方向(IEC 61188-7-2017);德文版本EN 61188-7-2017
Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction (IEC 61188-7:2017); German version EN 61188-7:2017
参考页数：21P.;A4
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电子元器件产品条形码和二维符号包装标签(IEC 62090-2017);德文版本EN 62090-2017
Product package labels for electronic components using bar code and two- dimensional symbologies (IEC 62090:2017); German version EN 62090:2017
参考页数：34P.;A4
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电子组装技术.第3部分:焊接接缝用环境和耐久性试验方法筛选导则(IEC 62137-3-2011).德文版本EN 62137-3-2012
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011); German version EN 62137-3:2012
参考页数：47P;A4
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环境试验.第2-69部分:试验.试验Te/Tc:采用湿平衡(力值测量)法的电子元件和印制板焊接性试验(IEC 60068-2-69-2017);德文版本EN 60068-2-69-2017
Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method (IEC 60068-2-69:2017); German version EN 60068-2-69:2017
参考页数：59P.;A4
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