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电子设备机电元件.基本测量和试验方法.第11部分:气候试验.第8节:检验 11h:砂尘
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11: Climatic tests; Section 8: Test 11h: Sand and dust (IEC 60512-11-8:1995); German version EN 60512-11-8:1999
参考页数：5P.;A4
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电子设备的机电元件.基本试验程序和测量方法.第11部分:气候试验.第1节:11a:气候系列
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 11: Climatic tests; Section 1: Test 11a: Climatic sequence (IEC 60512-11-1:1995); German version EN 60512-11-1:1999
参考页数：5P.;A4
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电子设备的机电元件.基本试验程序和测量方法.第19部分:耐化学性能试验.第3部分:19c试验.耐液体性能
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 19: Chemical resistance tests; section 3: Test 19c: Fluid resistance (IEC 60512-19-3:1997); German version EN 60512-19-3:1997
参考页数：6P.;A4
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生产方和回收方之间产品回收相关信息的传递. 回收通行证
Transmission of recycling relevant product information between producers and recyclers-The recycling passport
参考页数：26P.;A4
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电子设备用机电元件.基本试验规程和测量方法.第12部分:可钎焊性试验.第6节:试验12f:机械钎焊中耐溶剂和清洗剂的密封性试验
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 12: Soldering tests - Section 6: Test 12f: Sealing against flux and cleaning solvents in machine soldering (IEC 60512-12-6:1996); German version EN 60512-12-6:1996
参考页数：7P.;A4
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半导体器件. 微型机电装置. 第11部分:微型机电装置用无需支撑物材料线性热膨胀系数试验方法 (IEC 62047-11-2013); 德文版本EN 62047-11-2013
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013); German version EN 62047-11:2013
参考页数：21P;A4
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半导体器件. 微型机电装置. 第18部分:薄膜材料的弯曲试验方法 (IEC 62047-18-2013); 德文版本EN 62047-18-2013
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013
参考页数：15P;A4
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半导体器件. 微型机电装置. 第19部分: 电子罗盘(IEC 62047-19-2013); 德文版本EN 62047-19-2013
Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses (IEC 62047-19:2013); German version EN 62047-19:2013
参考页数：31P;A4
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半导体器件. 微型机电装置. 第26部分: 微槽和针孔结构的描述和测量方法(IEC 62047-26-2016); 德文版本EN 62047-26-2016
Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures (IEC 62047-26:2016); German version EN 62047-26:2016
参考页数：29P.;A4
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半导体装置.微电机装置.第14部分:金属薄膜材料的成型极限测量方法(IEC 62047-14-2012).德文版本EN 62047-14-2012
Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials (IEC 62047-14:2012); German version EN 62047-14:2012
参考页数：20P;A4
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