|
电子设备用机电元件.基本试验程序和测量方法.第20-2部分:试验20b.易燃性试验.防火性
Electromechanical components for electronic equipment -- Basic testing procedures and measuring methods -- Part 20-2: Test 20b -- Flammability tests -- Fireproofness
参考页数:10P;A4
|
|
|
|
|
|
电子设备连接器.试验和测量.第2-6部分:电连续性和接触电阻试验.试验2f:外壳电连续性
Connectors for electronic equipment -- Tests and measurements -- Part 2-6: Electrical continuity and contact resistance tests -- Test 2f: Housing (shell) electrical continuity
参考页数:6P;A4
|
|
|
|
|
|
电子设备用电机元件.基本试验程序和测量方法.第23-3部分:试验23c:连接件和附件的屏蔽效应
Electromechanical components for electronic equipment -- Basic testing procedures and measuring methods -- Part 23-3: Test 23c: Shielding effectiveness of connectors and accessories
参考页数:12P;A4
|
|
|
|
|
|
电子电器废弃物的收集, 物流和处理要求. 第2-2部分: 包含阴极射线管和平板显示器的电子电器废弃物的处理要求
Collection, logistics and treatment requirements for WEEE - Part 2-2 : treatment requirements for WEEE containing CRTs and flat panel displays
参考页数:23P.;A4
|
|
|
|
|
|
半导体器件.微电子机械器件.第10部分:MEMES材料微极压缩测试
Semiconductor devices - Micro-electromechanical devices - Part 10: micro-pillar compression test for MEMS materials
参考页数:15P;A4
|
|
|
|
|
|
半导体装置.微型机电装置.第1部分:术语和定义
Semiconductor devices - Micro- electromechanical devices - Part 1 : terms and definitions.
参考页数:26P.;A4
|
|
|
|
|
|
电子设备用机电元件.基本试验程序和测量方法.第13部分:机械运行试验.第1节:试验 13a:啮合力及分离力
Electromechanical components for electronic equipment. Basic testing procedures and measuring methods. Part 13 : mechanical operating tests. Section 1 : test 13a : engaging and separating forces.
参考页数:6P.;A4
|
|
|
|
|
|
电子设备用机电元件.基本试验程序和测量方法.第11部分:气候试验.第8节:试验 11h:沙尘
Eletromechanical components for electronic equipment. Basic testing procedures and measuring methods. Part 11 : climatic tests. section 8 : test 11h : sand and dust.
参考页数:8P.;A4
|
|
|
|
|
|
电子设备连接器.试验和测量.第11-7部分:温度试验.试验11:流动混 合气体的腐蚀试验
Connectors for electronic equipment - Tests and measurements - Part 11-7 : climatic tests - Test 11g : flowing mixed gas corrosion test.
参考页数:8P.;A4
|
|
|
|
|
|
电子设备用机电元件.基本试验程序和测量方法.第6部分:动态应力试验.第5节:试验6e:随机振动
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 6 : dynamic stress tests - Section 5 : test 6e : random vibration.
参考页数:8P.;A4
|
|
|
|
|