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半导体电阻应变计总规范(可供认证用)
General Specification for the semiconductor resistance strain gage
参考页数：17P.;A4
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半导体器件用钝化封装玻璃粉
Glass powder for passivation packaging for ues in semiconduoctor devices
参考页数：7P.;A4
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电子元器件图形库.半导体分立器件图形
Graphic base of electronic components graphics of semiconductor discrete device
参考页数：19P.;A4
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QG21-QG25型高频小功率晶体管F<下标t>测试仪试行检定规程
Trial specification for verification of QG21-QG25 high frequency low-power transistor F testers
参考页数：
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半导体器件. 微型机电装置. PDMS和玻璃之间的粘结强度的试验方法
Semiconductor devices. Micro-electromechanical devices. Test method of bonding strength between PDMS and glass
参考页数：18P.;A4
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半导体器件. 微型机电装置. 用于测量薄膜力学性能的胀形试验方法
Semiconductor devices. Micro-electromechanical devices. Bulge test method for measuring mechanical properties of thin films
参考页数：34P.;A4
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半导体器件. 微型机电装置. 用于测定MEMS薄膜晶片曲率剩余应力的试验方法和悬臂梁挠度法
Semiconductor devices. Micro-electromechanical devices. Test methods for determining residual stresses of MEMS films Wafer curvature and cantilever beam deflection methods
参考页数：18P.;A4
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半导体芯片产品. 对芯片用户和供应商的问卷调查
Semiconductor die products. Questionnaire for die users and suppliers
参考页数：42P.;A4
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半导体器件. 微型机电装置. 柔性基板上导电薄膜机电拉伸试验方法
Semiconductor devices. Micro-electromechanical devices. Electromechanical tensile test method for conductive thin films on flexible substrates
参考页数：14P.;A4
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半导体器件. 微型机电装置. 薄膜MEMS材料泊松比试验方法
Semiconductor devices. Micro-electromechanical devices. Test method for Poisson's ratio of thin film MEMS materials
参考页数：18P.;A4
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