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半导体器件. 微型机电装置. 陀螺仪
Semiconductor devices. Micro-electromechanical devices. Gyroscopes
参考页数：56P.;A4
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半导体器件. 机械和气候试验方法. 温度和湿度存储
Semiconductor devices. Mechanical and climatic test methods. Temperature and humidity storage
参考页数：12P.;A4
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有机晶体管和材料特性的试验方法
Test methods for the characterization of organic transistors and materials
参考页数：28P.;A4
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基于有机晶体管的环形振荡器特性的试验方法
Test methods for the characterization of organic transistor-based ring oscillators
参考页数：26P.;A4
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半导体器件.机械和气候试验方法.静电放电(ESD)灵敏度测试.人体模型(HBM)
Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Human body model (HBM)
参考页数：44P.;A4
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半导体器件的机械标准化. 半导体器件包封装外形的编码系统和分类形式
Mechanical standardization of semiconductor devices. Coding system and classification into forms of package outlines for semiconductor device packages
参考页数：28P.;A4
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光催化. 半导体材料光催化性能试验的辐照条件以及此类条件的测量
Photocatalysis. Irradiation conditions for testing photocatalytic properties of semiconducting materials and the measurement of these conditions
参考页数：26P.;A4
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半导体器件. 微型机电装置. 微槽和针孔结构的描述和测量方法
Semiconductor devices. Micro-electromechanical devices. Description and measurement methods for micro trench and needle structures
参考页数：34P.;A4
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半导体器件. 微型机电装置. 微型机电装置用无需支撑物材料线性热膨胀系数试验方法
Semiconductor devices. Micro-electromechanical devices. Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems
参考页数：24P;A4
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半导体器件.微型机电装置.薄膜材料的弯曲测试方法
Semiconductor devices. Micro-electromechanical devices. Bend testing methods of thin film materials
参考页数：18P;A4
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