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PMC处理器
Processor PMC
参考页数：
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装置内埋基板.第2-3部分:指南.设计指引
Device Embedded Substrate - Part 2-3: Guidelines - Design Guide
参考页数：50P.;A4
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装置内埋基板.第2-1部分:指南.通用技术说明
Device embedded substrate - Part 2-1: Guidelines - General description of technology
参考页数：60P.;A4
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装置内埋基板.第2-4部分:指南.测试元件组(TEG)
Device Embedded Substrate - Part 2-4: Guidelines - Test element groups (TEG)
参考页数：91P.;A4
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环境试验.第2-58部分:试验.试验Td:表面安装元器件(SMD)用可焊性、耐金属化溶融和耐焊接热的试验方法
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
参考页数：75P.;A4
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异构电子零件库的映射规则和交换方法. 构建综合查询系统
Mapping rules and exchanges methods for heterogeneous electronic - Part 1: Building an integrated search system
参考页数：31P.;A4
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电子组装技术. 第4部分: 区域阵列类型包装表面安装设备的焊接接缝的耐久性试验方法
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
参考页数：85P.;A4
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互连结构和附件用电气材料的试验方法.第1部分:一般试验方法和方法论
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
参考页数：26P.;A4
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电子组件用连接材料. 第1-2部分: 电子组装中高质量连接器用焊剂的要求
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering paste for high-quality interconnects in electronics assembly
参考页数：50P.;A4
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电子设备用机械结构设计模型化规则 第2部分:分规范 25mm设备接口配合尺寸
Modular order for the development of mechanical structures for electronic equipment practices; part 2: sectional specification; interface co-ordination dimensions for the 25 mm equipment practice
参考页数：33P.;A4
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