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半导体器件.机械和环境测试方法.动力循环
Semiconductor devices. Mechanical and climatic test methods. Power cycling
参考页数：14P;A4
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半导体器件.机械和气候试验方法.塑料密封器件的易燃性(外部感应)
Semiconductor devices. Mechanical and climatic test methods. Flammability of plastic-encapsulated devices (externally induced)
参考页数：8P;A4
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半导体器件.分立器件.半导体加速器
Semiconductor devices. Discrete devices. Semiconductor accelerometers
参考页数：102P;A4
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半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则.小外形封装(SOP)尺寸的测量方法
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
参考页数：18P;A4
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半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则.小外形J-引线封装(SOJ)的封装尺寸规格测量方法
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
参考页数：16P;A4
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半导体装置.依赖时间的金属层间的介质击穿(TDDB)试验
Semiconductor devices. Time-dependent dielectric breakdown (TDDB) test for inter-metal layers
参考页数：20P.;A4
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半导体器件.机械和气候试验方法.模剪切强度
Semiconductor devices. Mechanical and climatic test methods. Die shear strength
参考页数：10P.;A4
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半导体压模产品.采购和使用
Semiconductor die products. Procurement and use
参考页数：48P;A4
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半导体装置.机械和气候试验方法.利用变形测量器进行的板级落锤试验法
Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using a strain gauge
参考页数：26P;A4
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半导体器件.金属化应力空隙试验
Semiconductor devices. Metallization stress void test
参考页数：20P.;A4
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