标准号: |
BS EN 60191-6-17-2011 |
英文名称: |
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and PPFLGA) |
中标分类: |
电子元器件与信息技术>>半导体分立器件综合 |
发布日期: |
2011-06-30 |
发布单位: |
GB-BSI |
标准状态: |
请与本站工作人员进行确认 |
实施日期: |
2011-06-30 |
ICS分类: |
电气和电子工程制图>>电气和电子工程制图 |
起草单位/标准公告: |
BSI |
正文语言: |
英语 |
页数: |
32P.;A4 |
引用标准: |
IEC 60191-6;IEC 60191-6-5 |
采用关系: |
EN 60191-6-17-2011,IDT;IEC 60191-6-17-2011,IDT |
内容提要(EN): |
Ball Grid Array;Case drawing;Design;Dimensions;Drawings;Electric enclosures;Electrical engineering;Electronic engineering;Electronic equipment and components;Enclosures;Engineering drawings;Glossaries;Grid systems;Integrated circuits;Marking;Mechanic;Printed-circuit boards;Semiconductor devices;Semiconductor package;Semiconductors;Sockets;Testing |
归属: |
英国 |