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频带控制和选择用表面安装压电装置. 标准外形和端头连接. 第2部分: 陶瓷外壳
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures
参考页数:99P.;A4
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半导体器件的机械标准化. 第1部分: 分立器件外形图的一般规则(IEC 60191-1-2018); 德文版本EN IEC 60191-1-2018
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018
参考页数:41P.;A4
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半导体器件的机械标准化. 第1部分: 分立器件外形图的一般规则(IEC 60191-1-2018); 德文版本EN IEC 60191-1-2018
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices (IEC 60191-1:2018); German version EN IEC 60191-1:2018
参考页数:41P.;A4
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半导体器件的机械标准化.第1部分:分立器件外形图的一般规则
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
参考页数:36P.;A4
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半导体器件的机械标准化. 表面安装半导体器件封装轮廓图的一般制备规则. 硅细间距球栅格阵列和硅细间距栅格阵列半导体封装的设计指南(S-FBGA和S-FLGA)
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
参考页数:20P;A4
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半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则.堆栈封装的设计指南.细间距球栅阵列和细间距矩栅阵列(P-PFBGA和PPFLGA)
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and PPFLGA)
参考页数:32P.;A4
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半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则.小外形封装(SOP)尺寸的测量方法
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline packages (SOP)
参考页数:18P;A4
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半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则.小外形J-引线封装(SOJ)的封装尺寸规格测量方法
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Measuring methods for package dimensions of small outline J-lead packages (SOJ)
参考页数:16P;A4
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CAx系统中电机和电气应用之间互操作能力的要求
Requirements concerning the interoperability between electromechanical and electrical applications in CAx-systems
参考页数:38P;A4
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半导体设备的机械标准化.平面式安装半导体器件外壳外形图绘制的一般规则.球栅阵列(BGA)用设计指南
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for ball grid array (BGA)
参考页数:24P;A4
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