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半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages
参考页数:42P;A4
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半导体器件的机械标准化.表面安装半导体器件封装外形图绘制一般规则.玻璃密封陶瓷方型扁平封装设计指南
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
参考页数:14P;A4
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半导体器件的机械标准.分立器件外形图准备的一般规则
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of discrete devices
参考页数:40P.;A4
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半导体装置的机械标准化.表面安装的半导体装置封装外形图绘制的一般规则.1.5mm、1.27mm和1.00mm树脂球和引线端子封装的设计指南
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
参考页数:14P;A4
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半导体器件的机械标准化.表面安装的半导体器件封装外形图绘制的一般规则.海鸥翼式铅端子的设计指南
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
参考页数:12P;A4
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半导体器件机械标准化.表面安装半导体器件封装外形图绘制的一般规则.小螺距球栅阵列的设计指南
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitchball grid array (FBGA)
参考页数:14P;A4
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半导体装置的机械标准化.表面固定半导体装置包装外廓线绘制一般规则.包装尺寸测量方法
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
参考页数:20P;A4
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阴极射线管及其部件、连接件和量规的外形图的绘制
Preparation of outline drawings for cathode-ray tubes, their components, connections and gauges
参考页数:34P;A4
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半导体装置的机械标准化.集成电路略图绘制的一般规则
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of integrated circuits
参考页数:62P.;A4
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半导体器件的机械标准化.绘制表面安装半导体器件封装外形图的一般规则.焊球网格阵列封装尺寸的测量方法
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
参考页数:20P.;A4
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