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半导体器件的机械标准化.第6-18部分:表面安装半导体器件封装外形图绘制的一般规则.球栅阵列(BGA)的设计指南
Mechanical standardization of semiconductor devices - Part 6-18 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA).
参考页数:23P;A4
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半导体器件的机械标准化.第6-1部分:半导体器件包装用表面安装略图制备的一般规则.鸥型翼引线终端的设计指南
Mechanical standardization of semiconductor devices - Part 6-1 : general rules for the preparation of outline drawings of surface mounted semiconductor device parkages - Design guide for gull-wing lead terminals.
参考页数:10P.;A4
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半导体器件的机械标准化.第6-5部分:半导体器件包装用表面安装略图制备的一般规则.小螺距球面栅格排列的设计指南
Mechanical standardization of semiconductor devices - Part 6-5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA).
参考页数:12P.;A4
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半导体器件的机械标准化.第6-6部分:半导体器件包装用表面安装略图制备的一般规则.小螺距刃片栅格排列的设计指南
Mechanical standardization of semiconductor devices - Part 6-6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA).
参考页数:15P.;A4
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半导体器件的机械标准化.第6部分:表面安装半导体器件封装外形图绘制的一般规则.P-VSON的尺寸
Mechanical standardization of semiconductor devices - Part 6-10 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON.
参考页数:14P.;A4
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半导体装置的机械标准化.第6-4部分:表面安装半导体装置封装外形图绘制的一般规则.球状网格阵列(BGA)封装尺寸的测量方法
Mechanical standardization of semiconductor devices - Part 6-4 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA).
参考页数:19P.;A4
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半导体器件的机械标准化.第6-3部分:半导体器件包装用表面安装略图制备的一般规则.四方块包装件包装尺寸的测量方法
Mechnical standardization of semiconductor devices - Part 6-3 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP).
参考页数:19P.;A4
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半导体器件的机械标准化.第6-8部分:半导体器件包装用表面安装略图制备的一般规则.玻璃密封的陶瓷四方块的设计指南(G-QFP)
Mechanical standardization of semiconductor devices - Part 6-8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP).
参考页数:13P.;A4
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半导体器件的机械标准化.第3部分:集成电路外形图纸制备的一般规则
Mechnical standardization of semiconductor devices - Part 3 : general rules for the preparation of outline drawings of integrated circuits.
参考页数:59P.;A4
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半导体器件的机械标准化.第6-2部分:半导体器件包装用表面安装略图制备的一般规则.1.5 mm 、1.27 mm 和 1.00 mm 螺距球面和柱状终端包的设计指南
Mechnical standardization of semiconductor devices - Part 6-2 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages.
参考页数:13P.;A4
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