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半导体器件. 微型机电设备. 室温下独立导电薄膜的机电弛豫试验方法
Semiconductor devices. Micro-electromechanical devices. Electromechanical relaxation test method for freestanding conductive thin-films under room temperature
参考页数：14P.;A4
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半导体器件. 基于扫描的半导体器件老化水平估计
Semiconductor devices. Scan based ageing level estimation for semiconductor devices
参考页数：20P.;A4
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半导体器件.机械和气候试验方法.第28部分:静电放电(ESD)灵敏度试验.带电器件模型(CDM).器件级(IEC 60749-28-2017);德文版本EN 60749-28-2017
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level (IEC 60749-28:2017); German version EN 60749-28:2017
参考页数：50P.;A4
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半导体器件.机械和气候试验方法.第43部分:集成电路可靠性资格计划指南(IEC 60749-43-2017); 德文版本EN 60749-43-2017
Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans (IEC 60749-43:2017); German version EN 60749-43:2017
参考页数：40P.;A4
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半导体器件.机械和气候试验方法.第28部分:静电放电(ESD)灵敏度试验.带电器件模型(CDM).器件级(IEC 60749-28-2017);德文版本EN 60749-28-2017
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level (IEC 60749-28:2017); German version EN 60749-28:2017
参考页数：50P.;A4
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半导体器件.机械和气候试验方法.第43部分:集成电路可靠性资格计划指南(IEC 60749-43-2017); 德文版本EN 60749-43-2017
Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans (IEC 60749-43:2017); German version EN 60749-43:2017
参考页数：40P.;A4
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半导体器件.机械和气候试验方法.第13部分: 盐性环境
Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
参考页数：28P.;A4
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半导体器件的机械标准化.第2部分:尺寸规格.修改件20
Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 20
参考页数：13P.;A4
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半导体器件. 汽车用半导体接口. 第2部分: 使用汽车传感器谐振的无线功率传输的效率评估方法
Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
参考页数：21P.;A4
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半导体器件的机械标准化.第4部分:半导体器件封装外形图类型的划分和编号系统
Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
参考页数：152P.;A4
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