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半导体器件.微型机电装置.电子罗盘
Semiconductor devices. Micro-electromechanical devices. Electronic compasses
参考页数：34P;A4
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半导体器件的机械标准化. 表面安装半导体器件封装轮廓图的一般制备规则. 硅细间距球栅格阵列和硅细间距栅格阵列半导体封装的设计指南(S-FBGA和S-FLGA)
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
参考页数：20P;A4
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半导体装置.微电子机械装置.射频微机电转换器
Semiconductor devices. Micro-electromechanical devices. RF MEMS switches
参考页数：38P;A4
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半导体器件.机械和气候试验方法.静电放电(ESD)灵敏度测试.机器模型(MM)
Semiconductor devices. Mechanical and climatic test methods. Electrostatic discharge (ESD) sensitivity testing. Machine model (MM)
参考页数：16P;A4
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半导体设备.分立器件.绝缘的功率半导体器件
Semiconductor devices. Discrete devices. Isolated power semiconductor devices
参考页数：30P;A4
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半导体设备.微型机电装置.MEMS结构用测量粘合强度的弯曲和切变型式试验方法
Semiconductor devices. Micro-electromechanical devices. Bend-and shear-type test methods of measuring adhesive strength for MEMS structures
参考页数：18P;A4
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半导体装置.微电子机械装置.MEMS的晶圆与晶圆结合强度测量
Semiconductor devices. Micro-electromechanical devices. Wafer to wafer bonding strength measurement for MEMS
参考页数：32P;A4
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半导体元件.分立元件.基本和增强隔离用磁性和电容耦合器
Semiconductor devices. Discrete devices. Magnetic and capacitive coupler for basic and reinforced isolation
参考页数：44P;A4
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半导体装置.微型机电装置.使用MEMS结构的共振,薄膜材料的弯曲挠度试验方法
Semiconductor devices. Micro-electromechanical devices. Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures
参考页数：34P;A4
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半导体装置.微电子机械装置.MEMS材料的微型柱压缩试验
Semiconductor devices. Micro-electromechanical devices. Micro-pillar compression test for MEMS materials
参考页数：18P;A4
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