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半导体设备.半导体传感器.压力传感器
Semiconductor devices - Semiconductor sensors - Pressure sensors
参考页数：24P;A4
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半导体器件.机械和气候试验方法.第20-1部分:对潮湿和焊接热综合效应敏感元器件的操作,包装,标识和运输
Semiconductor devices - Mechanical and climatic test methods - Part 20-1:Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
参考页数：38P.;A4
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半导体器件.半导体传感器.传感器用一般规范
Semiconductor devices - Semiconductor sensors - Generic specification for sensors
参考页数：26P;A4
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半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages
参考页数：42P;A4
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半导体器件.半导体传感器.PN-结点半导体温度传感器
Semiconductor devices - Semiconductor sensors - PN-junction semiconductor temperature sensor
参考页数：22P;A4
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半导体器件.恒定电流电迁移试验
Semiconductor devices - Constant current electromigration test
参考页数：14P.;A4
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半导体器件的机械标准化.在高温及最大允许翘曲下构装翘曲的测量方法
Mechanical standardization of semiconductor devices - Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
参考页数：18P.;A4
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半导体器件上锡及锡合金表面装饰的锡晶须敏感性的环境验收要求
Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices
参考页数：52P;A4
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电子元器件用质量评估的协调体系.离散半导体器件.分规范
Harmonized system of quality assessment for electronic components - Discrete semiconductor devices - Sectional specification
参考页数：22P.;A4
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半导体器件.机械和气候试验方法.塑料包封的SMDs的抗湿及钎焊热度综合影响
Semiconductor devices - Mechanical and climatic test methods - Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
参考页数：32P.;A4
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