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半导体器件.机械和气候试验方法.第43部分:集成电路可靠性资格计划指南(IEC 60749-43-2017); 德文版本EN 60749-43-2017
Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans (IEC 60749-43:2017); German version EN 60749-43:2017
参考页数：40P.;A4
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半导体器件.机械和气候试验方法.第28部分:静电放电(ESD)灵敏度试验.带电器件模型(CDM).器件级(IEC 60749-28-2017);德文版本EN 60749-28-2017
Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level (IEC 60749-28:2017); German version EN 60749-28:2017
参考页数：50P.;A4
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半导体器件.机械和气候试验方法.第43部分:集成电路可靠性资格计划指南(IEC 60749-43-2017); 德文版本EN 60749-43-2017
Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans (IEC 60749-43:2017); German version EN 60749-43:2017
参考页数：40P.;A4
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半导体器件.机械和气候试验方法.第13部分: 盐性环境
Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
参考页数：28P.;A4
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半导体器件的机械标准化.第2部分:尺寸规格.修改件20
Mechanical standardization of semiconductor devices - Part 2: Dimensions; Amendment 20
参考页数：13P.;A4
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半导体器件的机械标准化.第4部分:半导体器件封装外形图类型的划分和编号系统
Mechanical Standardization of Semiconductor Devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
参考页数：152P.;A4
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半导体器件的机械标准化.第4部分:半导体器件封装外形图类型的划分和编号系统.修改件1
Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages; Amendment 1
参考页数：29P.;A4
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半导体器件的机械标准化.第1部分:分立器件外形图的一般规则
Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
参考页数：36P.;A4
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半导体器件.机械和气候试验方法.第26部分:静电放电敏感性(ESD)测试.人体模型(HBM)
Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
参考页数：106P.;A4
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半导体器件的机械标准化 第4部分：半导体器件封装外形图类型的划分以及编号体系
Mechanical standardization of semiconductor components Part 4 Classification and coding system for package outlines of semiconductor components
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