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半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则.小爆距纹间表面网格阵列(FLAG)的设计指南.术语推荐修改
Mechanical standardization of semiconductor devices - General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) - Proposed amendment on terminology
参考页数：16P;A4
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频率控制和选择用表面安装的压电器件.标准外形和终端引线的连接.第2部分:陶瓷封装(IEC 61837-2-2011+A1-2014); 德文版本EN 61837-2-2011+A1-2014
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures (IEC 61837-2:2011 + A1:2014); German version EN 61837-2:2011 + A1:2014
参考页数：90P.;A4
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半导体器件的机械标准化. 第6-22部分: 表面安装半导体器件封装轮廓图的一般制备规则. 硅细间距球栅格阵列和硅细间距栅格阵列半导体封装的设计指南(S-FBGA和S-FLGA) (IEC 60191-6-22-2012); 德文版本EN 60191-6-22-2013
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013
参考页数：18P.;A4
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压电装置.频率控制和选择用表面安装装置(SMD)框图的制备.通用规则(IEC 61240-2012).德文版本EN 61240-2012
Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules (IEC 61240:2012); German version EN 61240:2012
参考页数：19P.;A4
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半导体器件的机械标准化.第6-12部分:表面安装半导体设备包的外形图制备用一般规则.细间距栅极阵列的设计指南(FLGA)(IEC 60191-6-12-2011).德国
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German version EN 60191-6-12:2011
参考页数：20P;A4
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半导体器件的机械标准化.第6-21部分:表面安装半导体器件封装外形图绘制的一般规则.小外形封装(SOJ)的封装尺寸规格测量方法(IEC 60191-6
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
参考页数：17P.;A4
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半导体器件的机械标准化.第6部分:平面式安装半导体器件外壳外形图绘制的一般规则(IEC 60191-6-2009).德文版本EN 60191-6-2009
Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009
参考页数：40P;A4
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半导体器件的机械标准化.第6-20部分:表面安装半导体器件封装外形图绘制的一般规则.小外形J-引线封装(SOJ)的封装尺寸规格测量方法(IEC
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
参考页数：14P.;A4
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半导体器件的机械标准化.第6-18部分:表面安装半导体器件封装外形图绘制的一般规则.球状栅极阵列封装体(BGA)的设计指南(IEC 60191-6-18-2010 + Cor.-2010).德文版本EN 60191-6-18-2010
Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) (IEC 60191-6-18:2010 + Cor. :2010); German version EN 60191-6-18:2010
参考页数：22P;A4
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半导体器件的机械标准化.第6-6部分:平面安装的半导体器件外壳草图制备的一般规则.小螺距刃片栅格排列的设计指南(FLGA) (IEC 60191-6-6:2001);德文版本 EN 60191-6-6:2001
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine pitch land grid array (FLGA) (IEC 60191-6-6:2001); German version EN 60191-6-6:2001
参考页数：13P.;A4
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