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半导体装置.机械和气候耐受性试验方法.可焊性
Semiconductor devices. Mechanical and climatic test methods. Solderability
参考页数：26P.;A4
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半导体装置.机械和气候耐受性试验方法.闩锁效应测试
Semiconductor devices. Mechanical and climatic test methods. Latch-up test
参考页数：26P.;A4
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半导体装置.机械和气候耐受性试验方法.其他残余气体的内部湿度测量和分析
Semiconductor devices. Mechanical and climatic test methods. Internal moisture content measurement and the analysis of other residual gases
参考页数：16P;A4
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半导体器件.机械和气候试验方法.高温使用寿命
Semiconductor devices. Mechanical and climatic test methods. High temperature operating life
参考页数：12P.;A4
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半导体装置的机械标准化.表面安装半导体装置封装外形图制备的通用规范.细微间距栅级阵列(FLGA)的设计指南
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guidelines for fine-pitch land grid array (FLGA)
参考页数：24P.;A4
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半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则.堆栈封装的设计指南.细间距球栅阵列和细间距矩栅阵列(P-PFBGA和PPFLGA)
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and PPFLGA)
参考页数：32P.;A4
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半导体装置.微电机装置.薄膜拉伸性能测量用带材弯曲试验方法
Semiconductor devices. Micro-electromechanical devices. Strip bending test method for tensile property measurement of thin films
参考页数：22P.;A4
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半导体装置.微电子机械装置.射频控制和选择所用的微电子机械系统(MEMS)声表面滤波器(BAW)和双工器
Semiconductor devices. Micro-electromechanical devices. MEMS BAW filter and duplexer for radio frequency control and selection
参考页数：34P;A4
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半导体压模制品.交换数据格式.
Semiconductor die products. Exchange data formats
参考页数：74P.;A4
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半导体器件.机械和气候试验方法.密封
Semiconductor devices. Mechanical and climatic test methods. Sealing
参考页数：20P.;A4
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